Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Chironjeet Chaki; Manoshi Chaki; Keya Roy

doi:doi:10.11648/j.ajmsp.20190401.17

| Peer-Reviewed

Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process

Chironjeet Chaki, Manoshi Chaki, Keya Roy

Published in American Journal of Materials Synthesis and Processing (Volume 4, Issue 1)

Received: 30 May 2019 Accepted: 2 July 2019 Published: 15 July 2019

Views: Downloads:

Download PDF

Share This Article

Twitter
Linked In
Facebook

Abstract

A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application’s solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application ‘Matlab’. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.

Published in	American Journal of Materials Synthesis and Processing (Volume 4, Issue 1)
DOI	10.11648/j.ajmsp.20190401.17
Page(s)	54-61
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2019. Published by Science Publishing Group

Keywords

Diffusion Soldering, Finite Element Model, Power Electronic Application, Interconnection Technology

References

[1]	C. F. Dickinson and G. R. Heal, “Solid–liquid diffusion controlled rate equations”, Thermochimica Acta, vol. 340–341, pp. 89–103, 1999.
[2]	M. S. Park and R. Arróyave, “Computational investigation of intermetallic compounds (Cu 6Sn5 and Cu3Sn) growth during solid-state aging process”, Computational Materials Science, vol. 50, no. 5, pp. 1692–1700, 2011.
[3]	A. Staroselsky, R. Acharya, and B. Cassenti, “Phase field modeling of fracture and crack growth”, Engineering Fracture Mechanics, vol. 205, no. October 2018, pp. 268–284, 2019.
[4]	T. Min, Y. Gao, L. Chen, Q. Kang, and W. Q. Tao, “Mesoscale investigation of reaction-diffusion and structure evolution during Fe-Al inhibition layer formation in hot-dip galvanizing”, International Journal of Heat and Mass Transfer, vol. 92, pp. 370–380, 2016.
[5]	H. Vafaeenezhad, S. H. Seyedein, M. R. Aboutalebi, and A. R. Eivani, “Hybrid Monte Carlo – Finite element simulation of microstructural evolution during annealing of severely deformed Sn-5Sb alloy”, Computational Materials Science, vol. 163, pp. 196–208, Jun. 2019.
[6]	W. L. Chiu, C. M. Liu, Y. S. Haung, and C. Chen, “Formation of plate-like channels in Cu6Sn5and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures”, Materials Letters (Elsevier), vol. 164, pp. 5–8, 2016.
[7]	H. Ma, A. Kunwar, J. Sun, B. Guo, and H. Ma, “In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper”, Scripta Materialia (Elsevier), vol. 107, pp. 88–91, 2015.
[8]	Z. Huang, P. P. Conway, and R. Qin, “Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections”, Microsystem Technologies, vol. 15, no. 1 SPEC. ISS., pp. 101–107, 2009.
[9]	R. Turner, F. Schroeder, R. M. Ward, and J. W. Brooks, “The importance of materials data and modelling parameters in an FE simulation of linear friction welding”, Advances in Materials Science and Engineering, vol. 2014, pp. 1–9, 2014.
[10]	E. G. Flekkøy, R. Delgado-Buscalioni, and P. V. Coveney, “Flux boundary conditions in particle simulations”, Physical Review E - Statistical, Nonlinear, and Soft Matter Physics, vol. 72, no. 2, pp. 1–9, 2005.
[11]	J. F. Li, P. A. Agyakwa, and C. M. Johnson, “A numerical method to determine interdiffusion coefficients of Cu₆Sn₅ and Cu₃Sn intermetallic compounds”, Intermetallics (Elsevier), vol. 40, pp. 50–59, 2013.
[12]	B. Chao, S. H. Chae, X. Zhang, K. H. Lu, J. Im, and P. S. Ho, “Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing”, Acta Materialia, vol. 55, no. 8, pp. 2805–2814, 2007.
[13]	M. Wizard and G. Definitions, “Introduction to COMSOL Multiphysics,” pp. 1–6, 2014.
[14]	A. Morozov, A. Freidin, W. H. Müller, A. Semencha, and M. Tribunskiy, “Modeling temperature dependent chemical reaction of intermetallic compound growth”, 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, pp. 1–8.
[15]	Y. Tang, Q. W. Guo, S. M. Luo, et al., “Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process”, Journal of Alloys and Compounds (Elsevier), vol. 778, pp. 741–755, Mar. 2019.
[16]	C. Chaki, M. Chaki, and K. Roy, “Formation of Intermetallic Compounds in Diffusion Soldering Joints in High Temperature Power Electronic Applications”, International journal of innovative research in technology, vol. 5, no. 11, pp. 724–732, 2019.
[17]	M. Stadler, “Numerical Simulation of Reflow Soldering”, 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, pp. 1–6.

Cite This Article

Plain Text BibTeX RIS

APA Style

Chironjeet Chaki, Manoshi Chaki, Keya Roy. (2019). Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process. American Journal of Materials Synthesis and Processing, 4(1), 54-61. https://doi.org/10.11648/j.ajmsp.20190401.17

Copy | Download

ACS Style

Chironjeet Chaki; Manoshi Chaki; Keya Roy. Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process. Am. J. Mater. Synth. Process. 2019, 4(1), 54-61. doi: 10.11648/j.ajmsp.20190401.17

Copy | Download

AMA Style

Chironjeet Chaki, Manoshi Chaki, Keya Roy. Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process. Am J Mater Synth Process. 2019;4(1):54-61. doi: 10.11648/j.ajmsp.20190401.17

Copy | Download

@article{10.11648/j.ajmsp.20190401.17,
  author = {Chironjeet Chaki and Manoshi Chaki and Keya Roy},
  title = {Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process},
  journal = {American Journal of Materials Synthesis and Processing},
  volume = {4},
  number = {1},
  pages = {54-61},
  doi = {10.11648/j.ajmsp.20190401.17},
  url = {https://doi.org/10.11648/j.ajmsp.20190401.17},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ajmsp.20190401.17},
  abstract = {A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application’s solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application ‘Matlab’. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.},
 year = {2019}
}

Copy | Download

TY  - JOUR
T1  - Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process
AU  - Chironjeet Chaki
AU  - Manoshi Chaki
AU  - Keya Roy
Y1  - 2019/07/15
PY  - 2019
N1  - https://doi.org/10.11648/j.ajmsp.20190401.17
DO  - 10.11648/j.ajmsp.20190401.17
T2  - American Journal of Materials Synthesis and Processing
JF  - American Journal of Materials Synthesis and Processing
JO  - American Journal of Materials Synthesis and Processing
SP  - 54
EP  - 61
PB  - Science Publishing Group
SN  - 2575-1530
UR  - https://doi.org/10.11648/j.ajmsp.20190401.17
AB  - A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application’s solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application ‘Matlab’. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.
VL  - 4
IS  - 1
ER  -

Copy | Download

Author Information

Chironjeet Chaki

Department of Mechanical Engineering, Rajshahi University of Engineering & Technology, Rajshahi, Bangladesh
Manoshi Chaki

Department of Apparel Engineering, Bangladesh University of Textiles, Dhaka, Bangladesh
Keya Roy

Department of Civil Engineering, Rajshahi University of Engineering & Technology, Rajshahi, Bangladesh

Download PDF

Sections

Plain Text BibTeX RIS

APA Style

Chironjeet Chaki, Manoshi Chaki, Keya Roy. (2019). Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process. American Journal of Materials Synthesis and Processing, 4(1), 54-61. https://doi.org/10.11648/j.ajmsp.20190401.17

Copy | Download

ACS Style

Chironjeet Chaki; Manoshi Chaki; Keya Roy. Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process. Am. J. Mater. Synth. Process. 2019, 4(1), 54-61. doi: 10.11648/j.ajmsp.20190401.17

Copy | Download

AMA Style

Chironjeet Chaki, Manoshi Chaki, Keya Roy. Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process. Am J Mater Synth Process. 2019;4(1):54-61. doi: 10.11648/j.ajmsp.20190401.17

Copy | Download

@article{10.11648/j.ajmsp.20190401.17,
  author = {Chironjeet Chaki and Manoshi Chaki and Keya Roy},
  title = {Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process},
  journal = {American Journal of Materials Synthesis and Processing},
  volume = {4},
  number = {1},
  pages = {54-61},
  doi = {10.11648/j.ajmsp.20190401.17},
  url = {https://doi.org/10.11648/j.ajmsp.20190401.17},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ajmsp.20190401.17},
  abstract = {A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application’s solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application ‘Matlab’. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.},
 year = {2019}
}

Copy | Download

TY  - JOUR
T1  - Development of a Simplistic Method to Simulate the Formation of Intermetallic Compounds in Diffusion Soldering Process
AU  - Chironjeet Chaki
AU  - Manoshi Chaki
AU  - Keya Roy
Y1  - 2019/07/15
PY  - 2019
N1  - https://doi.org/10.11648/j.ajmsp.20190401.17
DO  - 10.11648/j.ajmsp.20190401.17
T2  - American Journal of Materials Synthesis and Processing
JF  - American Journal of Materials Synthesis and Processing
JO  - American Journal of Materials Synthesis and Processing
SP  - 54
EP  - 61
PB  - Science Publishing Group
SN  - 2575-1530
UR  - https://doi.org/10.11648/j.ajmsp.20190401.17
AB  - A simplistic simulation technique has been developed for computing the individual intermetallic compound (IMC) thickness which is formed in substrate-solder (Cu-Sn) systems during the diffusion soldering process in high-temperature power electronic applications. The method requires the time-dependent temperature profile for the soldering process and the growth rate parameters (e.g. concentration gradient, diffusion coefficient, activation energy, etc.) for the development of IMC layers as input. The method is suitable for predicting the thickness of an intermetallic phase layer during the diffusion soldering process. As such, it can be used in high-temperature power electronic application’s solder processing to enhance the reliability and lifetime of solder interconnections by allowing the control of the thickness of IMC layers. The method is demonstrated for IMC growth between pure copper as substrate and pure Sn as solder material. The growth behavior of the IMC layer is increased with increasing temperature over time according to the Arrhenius theory in the temperature range between 24°C to 260°C. To simulate the formation of IMC thickness in diffusion soldering interconnections, a simplistic way has been attempted using the popular commercial finite element simulation tool Comsol Multiphysics and scientific computing application ‘Matlab’. By means of transient thermal input, the diffusion-controlled intermetallic phase formation is simulated here. Few assumptions are taken care of this simulation process, for example, no convection, no reaction, solid-solid diffusion, no the pressure effect on the computational domain.
VL  - 4
IS  - 1
ER  -

Copy | Download