Special Issue
Submission Closed
Mechanical Engineering and Applications on Semiconductor Industry
01About This Special Issue
The issue will focus on mechanical engineering and application on semiconductor and green energy. With the development of AI and clean energy, higher requirement of mechanical devices are needed to fit with smaller but smarter silicon chips. Hope the issue can help journal have more attention from both academic and industrial readers.
Aims and Scope:
- Mechanical design for silicon chips
- Mechanical design and challenges for next generation devices
- AI and clean energy trend and requirement for mechanical engineering
02Meet the Guest Editors
Our distinguished editors bring deep subject-matter expertise to curate high-quality research and ensure a rigorous peer-review process.
Lead Guest Editor
Jinfeng Wang
Engineering, Cabot Microelectronics, Aurora, United States
Guest Editor
Wei Fan
Engineering, Cabot Microelectronics, Aurora, United States
Guest Editor
Wei Wei
Engineering, Cabot Microelectronics, Aurora, United States
Guest Editor
Phil Fraundorf
Physics, University of Missouri, St. Louis, United States
Guest Editor
Wentao Qin
R&D, On Semiconductor, Phoenix, United States
Guest Editor
Qinmin Yang
Mechanical Engineering Department, Zhejiang University, Hangzhou, China
